Multichip Packaging (MCP) defines a packaging option in which multiple die and/or packaged devices (SOICs, CSPs) are incorporated into a single package. The MCP may be considered as an alternative to ...

Written by Rao Tummala, the field s leading author, this rigorous, thorough introduction to electronic packaging technologies provides a solid grounding in microelectronics, photonics, RF, packaging ...

Biden and Modi hail ‘watershed agreement’; Fab will supply chips to US and Indian defence forces; India says it showcases ...

Benchmark Co. analyst Cody Acree has reiterated their neutral stance on INTC stock, giving a Hold rating today. Cody Acree has given his Hold ...

Chiplet-based products must accommodate small differences in die size and bump pitch, placing new demands on manufacturing ...

Chips that have been fully tested before being placed into their packages. Chips used in ceramic-based multichip modules (MCMs) are typically fully tested beforehand, because the ceramic ...

Early and fine binning can index individual chips on a single wafer to very narrow operating ranges. This can be used to benefit more recent MPUs that use multichip module (MCM) or 2.5D packaging ...

The Apple Vision Pro AR head unit contains two 100 Hz micro-OLED displays. Inside these displays are the following electronic ...

Little of this is specific to wireless; the same trend of integration from multichip to single chip to ASIC component has been observed in practically every technology. However, as integration ...

While a modular approach provides answers to the complexity and cost of multichip packaging, this paradigm shift brings about specific technological challenges. Size is just one challenge. A ...

Analysts have set 12-month price targets for MACOM Technology Solns, revealing an average target of $120.83, a high estimate of $135.00, and a low estimate of $110.00. Witnessing a positive shift, the ...

It derives a majority of its revenue from platform products, which incorporate various components and technologies, including a microprocessor and chipset, a stand-alone SoC, or multichip package.