Press Release Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance ...

Siemens Digital Industries Software today announced it has extended its longstanding collaboration with TSMC through multiple ...

Siemens services encompass crucial elements of the IC design flow, such as place-and-route, DFT, functional verification, ...

A controller, digital micromirror device, and power-management IC team up to enable ultra-short-throw projected gaming ...

ROHM Co., Ltd. has released the sixth German-language installment in the "Stories of Manufacturing" series of short films, this time taking viewers behind the scenes at the development of GaN devices, ...

Advanced IC packaging is transforming the semiconductor industry, driving performance and efficiency amid the global chip ...

MC33777, which NXP calls battery junction box IC, integrates critical pack-level functions into a single device, reducing ...

TSMC's COUPE is a 3D-IC assembly that stacks electronic chips on top of photonic chips, connecting fiber optics directly to ...

Why the chip industry is so focused on large language models for designing and manufacturing chips, and what problems need to ...

At the TSMC OIP Ecosystem Forum in Santa Clara, Synopsys announced EDA tool, IP and process collaborations. The two companies ...

It also supports HDR10+ content and Dolby Vision. Gorilla Glass Victus 2 protection is included on both phones. The Xiaomi ...

CDNS is focused on boosting productivity for AI-driven advanced-node designs and 3D-IC Solutions in collaboration with TSMC ...