Press Release Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance ...

Siemens services encompass crucial elements of the IC design flow, such as place-and-route, DFT, functional verification, ...

Siemens Digital Industries Software today announced it has extended its longstanding collaboration with TSMC through multiple ...

A controller, digital micromirror device, and power-management IC team up to enable ultra-short-throw projected gaming ...

Advanced IC packaging is transforming the semiconductor industry, driving performance and efficiency amid the global chip ...

EnSilica is pleased to announce that it has joined the Design Center Alliance ("DCA") of the Taiwan Semiconductor ...

MC33777, which NXP calls battery junction box IC, integrates critical pack-level functions into a single device, reducing ...

TSMC's COUPE is a 3D-IC assembly that stacks electronic chips on top of photonic chips, connecting fiber optics directly to ...

At the TSMC OIP Ecosystem Forum in Santa Clara, Synopsys announced EDA tool, IP and process collaborations. The two companies ...

Why the chip industry is so focused on large language models for designing and manufacturing chips, and what problems need to ...

It also supports HDR10+ content and Dolby Vision. Gorilla Glass Victus 2 protection is included on both phones. The Xiaomi ...

CDNS is focused on boosting productivity for AI-driven advanced-node designs and 3D-IC Solutions in collaboration with TSMC ...