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Electronic Design
3 天
Chipsets Essential to Projecting Gaming Displays Anywhere
A controller, digital micromirror device, and power-management IC team up to enable ultra-short-throw projected gaming ...
Hackaday
1 个月
Hardware Reuse: The PMG001 Integrated Power Management Module
Battery management is a tedious but necessary problem that becomes more of a hassle with lithium-ion technology. As we’re all very aware, such batteries need a bit of care to be utilized safely ...
EDN
9 天
New design frontiers in BMS hardware and software
Take the case of NXP’s MC33777 battery management IC, which integrates sense, think and act capabilities on a single chip ...
Electropages
9 天
Advanced IC Packaging and Its Role in the Chip Wars
Advanced IC packaging is transforming the semiconductor industry, driving performance and efficiency amid the global chip ...
EPT
7 天
Power factor correction chokes boost applications up to 1000Vdc
ITG ELECTRONICS PFC333232DH Series of power factor correction chokes (PFCs) for particularly high-voltage applications are ...
Electronic Design
8 天
Handling High Power Density in Additive Manufacturing
Additive manufacturing (AM), otherwise known as 3D printing, is an incredible process that creates three-dimensional, ...
1 天
TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon ...
Press Release Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance ...
Design-Reuse
21 小时
Siemens extends collaboration with TSMC to advance integrated circuit and systems design
Siemens Digital Industries Software today announced it has extended its longstanding collaboration with TSMC through multiple ...
Dataquest
16 小时
Siemens and TSMC to advance integrated circuit and systems design
Siemens services encompass crucial elements of the IC design flow, such as place-and-route, DFT, functional verification, ...
AV Network
20 小时
SCN Celebrates Best in Market 2024 Winners
Take a look at 12 new or updated products that caught the attention of our judges.
TMCnet
1 天
TSMC Expands Collaboration with Ansys by Integrating AI Technology to Accelerate 3D-IC Design
TSMC's COUPE is a 3D-IC assembly that stacks electronic chips on top of photonic chips, connecting fiber optics directly to ...
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