Phononic announced the Hex 2.0 CPU cooler at the Hot Chips conference, which is targeting at the data center. The company showed off while using an AMD Ryzen 9950X for stress testing, however.
产品创新层面,安森美推出了全新的1200V EliteSiC M3S功率模块和分立器件,在导通电阻、开关损耗以及高温工作性能上具有显著优势,能够支持电动汽车实现更高的能效和更长的续航里程。同时,在封装技术上也不断创新,如VE-Trac Direct SiC模块,采用直接水冷技术和模块化设计,提高了能效、功率密度和可靠性。