Multichip Packaging (MCP) defines a packaging option in which multiple die and/or packaged devices (SOICs, CSPs) are incorporated into a single package. The MCP may be considered as an alternative to ...
Written by Rao Tummala, the field s leading author, this rigorous, thorough introduction to electronic packaging technologies provides a solid grounding in microelectronics, photonics, RF, packaging ...
Intel Co. (NASDAQ:INTC – Get Free Report) rose 0.3% during trading on Friday . The company traded as high as $26.40 and last traded at $26.32. Approximately 25,460,857 shares traded hands during ...
Canada-based research firm TechInsights conducted a die analysis of the Huawei Ascend 910B AI Trainer, releasing its findings on Oct. 9. The device is considered to be the most advanced AI chip ...
In this, a high-speed die-to-die interface is added to connect the ASIC to an FPGA chiplet. The combined solution is then combined in an multichip module (MCM). The advantage to this approach is that ...