Press Release Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance ...

Siemens services encompass crucial elements of the IC design flow, such as place-and-route, DFT, functional verification, ...

TSMC's COUPE is a 3D-IC assembly that stacks electronic chips on top of photonic chips, connecting fiber optics directly to ...

Siemens Digital Industries Software today announced it has extended its longstanding collaboration with TSMC through multiple ...

The STPMIC25 power-management IC supports the STM32MP2 with 16 channels to supply all the MPU power rails as well as system peripherals in one package. Completing the hardware design requires only a ...

Plano, Texas, USA -- September 24, 2024-- Siemens Digital Industries Software today announced that Japan-based Preferred ...

Additive manufacturing (AM), otherwise known as 3D printing, is an incredible process that creates three-dimensional, ...

This pioneering agreement between Tata Electronics and PSMC will bring to India a portfolio of cutting-edge semiconductor technologies, advanced skill set and talent, and a network of semiconductor ...

Siemens Digital’s Calibre Platform tool has been certified for TSMC’s N2 and N2P processes. The N2 certification includes the new LSVRF (Local Standard ...

Why the chip industry is so focused on large language models for designing and manufacturing chips, and what problems need to ...