Abstract: This paper studies on the influence of different thermal interface materials (TIMs) on the thermal coupling among devices inside the semiconductor power modules. In particular, an ...
Abstract: The dynamic thermal coupling within gallium nitride (GaN) high electron mobility transistors (HEMTs) is characterized and modeled in a finite element method (FEM) solver to determine the ...
Multiphysics challenges in 3D ICs involve managing the combined impacts of electrical, thermal, and mechanical phenomena, which are more complex than in 2D IC designs. New materials used in 3D ICs ...
If so, the best thermal coffee makers can ensure your beverage stays at the perfect temperature, even hours after your initial brew. Our top recommendation is the OXO Brew Coffee Maker ...
The new cartridge versions of the company's established quick disconnect couplers (NSA, NSE, and NSI) feature advanced blind-mate functionality, permitting seamless connections even in misaligned ...
Some vehicles can have nearly 40 different harnesses to connect all the ICs. Like so much of the semiconductor industry, the automotive industry is now turning towards 3D-IC design techniques to help ...