Global wafer dicing services market was valued at US$ 578.8 million in 2023 and is projected to exceed valuation of US$ 838.9 million by 2032 at a CAGR of 4.21% during the forecast period 2024–2032.
Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of semiconductor or other material following wafer or module ...