Reverse recovery is an inherent occurrence in MOSFET body diodes, and negative effects are amplified by increased junction ...

KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological ...

In-house flows are unable to keep up with foundry PDKs and heterogeneous integration, but commercial EDA tools add their own set of challenges.

Emerging advanced semiconductor packaging technologies, such as 2.5D and 3D hybrid bonding, are crucial for enhancing system ...

Have you wondered why the printed circuit wires on high-frequency circuits don't always run in a straight line? This valuable text will answer all of your questions regarding component parasitics and ...

This article presents in detail discussion on the operating principle, continuous conduction mode (CCM) and, discontinuous conduction modes (DCM) and the parasitics effect on the output voltage and ...

Cu-Cu bumpless hybrid bonding is emerging as a leading innovation that creates permanent interconnections by combining a ...

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A key trend of this integration – especially for 3D packaging technologies such as hybrid bonding – has led to an aggressive shrinking of the BUMP pitches between the chiplets and the resulting ...

OpenTimer is a new static timing analysis (STA) tool to help IC designers quickly verify the circuit timing. It is developed completely from the ground up using C++17 to efficiently support parallel ...

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