Chinese SiC wafer company exhibits first 300mm N-type SiC substrate at Electronica 2024 At Electronica 2024, Chinese SiC wafer company SICC will exhibit what is thought be the first 300mm N-type SiC ...

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Rohm Semiconductor has announced new surface mount SiC Schottky barrier diodes (SBDs) that improve insulation resistance by ...

X-FAB and SMART Photonics recently signed a Memorandum of Understanding to formalise their collaboration. The aim is to ...

Companies to use X-Celeprint's micro-transfer printing to build next gen transceivers with silicon photonics and InP integration Specialist foundry X-FAB, and InP photonics foundry SMART Photonics ...