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Semiconductor Engineering
23 小时
How Die Dimensions Challenge Assembly Processes
Chiplet-based products must accommodate small differences in die size and bump pitch, placing new demands on manufacturing ...
Semiconductor Engineering
22 小时
Managing EMI in High-Density Integration
Controlling interference in today’s SoCs and advanced packaging requires a combination of innovative techniques, but new ...
Semiconductor Engineering
21 小时
New Materials Are in High Demand
Development methodologies combine old and new techniques, but getting any new material into high-volume manufacturing is a ...
Semiconductor Engineering
17 小时
InRak Kim
The conventional flip chip ball grid array (FCBGA) package platform has wide industry usage and provides high electrical ...
Semiconductor Engineering
14 小时
Chip Industry Week In Review
Synopsys’ optical biz sale to Keysight; Intel’s turnaround plan; $3B Secure Enclave funding; ADI/Tata alliance; imec’s solid-state li batteries; die dimensions challenge assembly processing; CXL; ...
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