A major point of defects and field failures in high-density PCBs and packaging is in the vias that form vertical ...

报道称，总部位于加利福尼亚州圣安娜的TTM将利用新工厂生产超高密度互连（UHDI）印刷电路板（PCB），该产品主要用于美国军事应用。 根据Hochul办公室的说法，TTM还将投资用于研发，以进一步整合美国各地的基板和UHDI PCB技术。TTM的新工厂将是美国首批专门生产 ...

SAN JOSE -- Industry veteran Vern Solberg has released a new book on designing for SMT and UHDI boards.

Hardware-assisted verification; ultra high-density interconnects; generating PCB documentation; errors in ESD verification.

Siemens’ Kyle Fraunfelter explores the similarities between hurricane forecasting and semiconductor manufacturing to argue for the value of integrating real-time wafer fabrication measurements into ...