A major point of defects and field failures in high-density PCBs and packaging is in the vias that form vertical ...

Hardware-assisted verification; ultra high-density interconnects; generating PCB documentation; errors in ESD verification.

Officials from the state and TTM Technologies, Inc. (NASDAQ: TTMI) on Oct. 4 held a beam-signing ceremony at the site of the firm’s $130 million expansion project adjacent to the company’s existing ...

As demand increases for optics, fiber cables and the 800GE Ethernet interconnects required to build artificial intelligence, machine learning and high-performance computing network infrastructure, the ...