Siemens services encompass crucial elements of the IC design flow, such as place-and-route, DFT, functional verification, ...

Siemens Digital Industries Software today announced it has extended its longstanding collaboration with TSMC through multiple ...

Advanced IC packaging is transforming the semiconductor industry, driving performance and efficiency amid the global chip ...

Vietnam has unveiled its semiconductor roadmap for 2025-2050, aiming to establish three fabs, 20 integrated circuit (IC) ...

Large indigenous chip design companies can achieve better economies of scale that would give an edge with respect to the cost ...

U-blox has created an all-band all-constellation precision GNSS receiver, a successor to its F9 IC. X20, as it will be known, ...

Electronic waste and its associated pollution are becoming increasingly threatening on a global scale. With the continued ...

Press Release Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance ...

NXP MC33777 battery junction box integrated circuit (IC) integrates critical pack-level functions into a single device.

Students have opportunity to design chips - manufactured in TI’s 300mm semiconductor fabrication plant in North Texas ...

Ansys (NASDAQ: ANSS) and TSMC have expanded their collaboration to leverage AI for advancing 3D-IC design and develop next ...