Electronic packaging consists of a plastic, ceramic, or metal enclosure that houses an integrated circuit (IC) on a silicon or metal die. Electronic packaging and interconnect components are an ...

CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs. DIP Dual in-line package (DIP) is a type of DRAM component packaging.

Ms. Duanrong Liu, the COO of ICZOOM, was invited as a speaker to deliver a speech at the 2024 Global Distribution and Supply Chain leaders Summit at the ICC Shenzhen, discussing about the challenges ...

Innovations in power ICs meet evolving industrial and robotics requirements, including the need for higher power efficiency ...

Leading integrated device manufacturers (IDMs) have expressed concerns about the automotive semiconductor market outlook for ...

According to a recent analysis by Future Market Insights (FMI), the global LED Driver IC Market for 2023 to 2033 is set to witness remarkable growth. Valued at USD 2,485.7 million in 2022, the market ...

The gate driver IC has been launched for applications like brake-by-wire and steer-by-wire systems, which meet top automotive ...