Multichip Packaging (MCP) defines a packaging option in which multiple die and/or packaged devices (SOICs, CSPs) are incorporated into a single package. The MCP may be considered as an alternative to ...
Written by Rao Tummala, the field s leading author, this rigorous, thorough introduction to electronic packaging technologies provides a solid grounding in microelectronics, photonics, RF, packaging ...
Canada-based research firm TechInsights conducted a die analysis of the Huawei Ascend 910B AI Trainer, releasing its findings on Oct. 9. The device is considered to be the most advanced AI chip ...
Intel Co. (NASDAQ:INTC – Get Free Report) rose 0.3% during trading on Friday . The company traded as high as $26.40 and last traded at $26.32. Approximately 25,460,857 shares traded hands during ...