Cadence Design Systems is collaborating with TSMC to enhance productivity and optimise product performance for AI-driven ...

Siemens’ EDA solutions are being combined with TSMC’s silicon process and advanced packaging technologies to advance IC and ...

Press Release Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance ...

Siemens Digital Industries Software today announced it has extended its longstanding collaboration with TSMC through multiple ...

A controller, digital micromirror device, and power-management IC team up to enable ultra-short-throw projected gaming ...

Siemens services encompass crucial elements of the IC design flow, such as place-and-route, DFT, functional verification, ...

ROHM Co., Ltd. has released the sixth German-language installment in the "Stories of Manufacturing" series of short films, this time taking viewers behind the scenes at the development of GaN devices, ...

Advanced IC packaging is transforming the semiconductor industry, driving performance and efficiency amid the global chip ...

MC33777, which NXP calls battery junction box IC, integrates critical pack-level functions into a single device, reducing ...

TSMC's COUPE is a 3D-IC assembly that stacks electronic chips on top of photonic chips, connecting fiber optics directly to ...

Why the chip industry is so focused on large language models for designing and manufacturing chips, and what problems need to ...

Ice Universe, a well-known tipster, actually said that the OPPO Find X8 will have the thinnest bezels in the industry. You’ll notice that its power/lock and volume up and down buttons are placed on ...