Press Release Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance ...

Ansys (NASDAQ: ANSS) and TSMC have expanded their collaboration to leverage AI for advancing 3D-IC design and develop next ...

Siemens services encompass crucial elements of the IC design flow, such as place-and-route, DFT, functional verification, ...

Cadence Design Systems is collaborating with TSMC to enhance productivity and optimise product performance for AI-driven ...

Siemens’ EDA solutions are being combined with TSMC’s silicon process and advanced packaging technologies to advance IC and ...

Siemens Digital Industries Software today announced it has extended its longstanding collaboration with TSMC through multiple ...

The STPMIC25 power-management IC supports the STM32MP2 with 16 channels to supply all the MPU power rails as well as system peripherals in one package. Completing the hardware design requires only a ...

Why the chip industry is so focused on large language models for designing and manufacturing chips, and what problems need to ...

Plano, Texas, USA -- September 24, 2024-- Siemens Digital Industries Software today announced that Japan-based Preferred ...

Additive manufacturing (AM), otherwise known as 3D printing, is an incredible process that creates three-dimensional, ...