This chapter tackles magneto-thermal coupling problems and presents formulations, resolution methods, as well as the applications relating to induction heating (IH) of metallic or fluid (plasma) ...

Multiphysics challenges in 3D ICs involve managing the combined impacts of electrical, thermal, and mechanical phenomena, which are more complex than in 2D IC designs. New materials used in 3D ICs ...

The new cartridge versions of the company's established quick disconnect couplers (NSA, NSE, and NSI) feature advanced blind-mate functionality, permitting seamless connections even in misaligned ...