Phenolic, melamine, and formaldehyde resins are thermosetting adhesives that form strong bonds and have good resistance to high temperatures. As thermoset materials, they require heat or heat and ...
Description: and bond stability from -55C to 100C. PNU-46202™ bonds well to most metals, ceramics and plastics as well as to epoxy and paper phenolic circuit boards. The clarity of PNU-46202™ allows ...